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A 0.35 mu m CMOS UWB-inspired bidirectional communication system-on-chip for transcutaneous optical biotelemetry links
File | Description | Size | Format | |
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IEEE_BioCAS_2019_UPLINK_CHIP_final.pdf | Accepted version | 1.47 MB | Adobe PDF | View/Open |
Title: | A 0.35 mu m CMOS UWB-inspired bidirectional communication system-on-chip for transcutaneous optical biotelemetry links |
Authors: | De Marcellis, A Stanchieri, GDP Palange, E Faccio, M Constandinou, TG |
Item Type: | Conference Paper |
Abstract: | In this paper we report on the fabrication, implementation and experimental characterization of an integrated bidirectional communication System-on-Chip (SoC) for transcutaneous bidirectional optical biotelemetry links. The proposed architecture implements a UWB-inspired pulsed coding technique and contains a transmitter and a receiver to achieve a simultaneous bidirectional link. The transmitter generates sub- nanosecond current pulses to directly drive offchip pulsed vertical cavity semiconductor lasers by means of a digital data coding subsystem and all the needed bias and driving circuits. The receiver interfaces to off-chip fast Si photodiodes and includes signal conditioning, detection and digital data decoding circuits to support high bit rate and energy efficient communication links. The SoC has been implemented in a commercially-available 0.35 mu m CMOS technology provided by AMS, occupying a compact silicon footprint of less than 0.13 mm2 employing 113 transistors and 1 resistor. This is evaluated using a testbench consisting of a custom PCB and a Xilinx Virtex-6 XC6VLX240T FPGA board. Preliminary experimental results validated the correct functionality of the overall integrated system demonstrating its capability to operate, also in a bidirectional mode, at bit rates up to 250 Mbps with pulse widths down to 1.2 ns and a minimum total power efficiency of about 160 pJ/bit in the conditions for which the transmitter and the receiver work simultaneously on the same chip. This demonstrated performance makes the optical biotelemetry particularly suitable for highly scalable (i.e., high bitrate, low energy per bit) implantable devices such as brain machine interfaces. |
Issue Date: | 17-Oct-2019 |
Date of Acceptance: | 31-Aug-2019 |
URI: | http://hdl.handle.net/10044/1/90708 |
ISSN: | 2163-4025 |
Publisher: | IEEE |
Journal / Book Title: | 2019 IEEE Biomedical Circuits and Systems Conference (BioCAS) |
Copyright Statement: | © 2019 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. See http://www.ieee.org/publications_standards/publications/rights/index.html for more information. |
Sponsor/Funder: | Engineering & Physical Science Research Council (EPSRC) |
Funder's Grant Number: | EP/M020975/1 |
Conference Name: | IEEE Biomedical Circuits and Systems Conference (BioCAS) |
Keywords: | Science & Technology Technology Computer Science, Information Systems Engineering, Biomedical Engineering, Electrical & Electronic Computer Science Engineering Bidirectional link System-on-Chip Optical communication Transcutaneous biotelemetry Science & Technology Technology Computer Science, Information Systems Engineering, Biomedical Engineering, Electrical & Electronic Computer Science Engineering Bidirectional link System-on-Chip Optical communication Transcutaneous biotelemetry |
Publication Status: | Published |
Start Date: | 2019-10-17 |
Finish Date: | 2019-10-19 |
Conference Place: | Nara, JAPAN |
Appears in Collections: | Electrical and Electronic Engineering Faculty of Engineering |