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Copper(I) thiocyanate (CuSCN) as a hole-transport material for large-area opto/electronics

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Review of CuSCN Applications_Semicond. Sci. Technol. 30_104002_2015.pdfAccepted version2.79 MBAdobe PDFView/Open
Title: Copper(I) thiocyanate (CuSCN) as a hole-transport material for large-area opto/electronics
Authors: Wijeyasinghe, N
Anthopoulos, TD
Item Type: Journal Article
Issue Date: 24-Aug-2015
Date of Acceptance: 1-Jul-2015
URI: http://hdl.handle.net/10044/1/29609
DOI: https://dx.doi.org/10.1088/0268-1242/30/10/104002
ISSN: 1361-6641
Publisher: IOP Publishing
Journal / Book Title: Semiconductor Science and Technology
Volume: 30
Issue: 10
Copyright Statement: © 2015 IOP Publishing Ltd. This is an author-created, un-copyedited version of an article accepted for publication in Semiconductor Science and Technology. IOP Publishing Ltd is not responsible for any errors or omissions in this version of the manuscript or any version derived from it. The definitive publisher authenticated version is available online at http://iopscience.iop.org/article/10.1088/0268-1242/30/10/104002
Keywords: Science & Technology
Technology
Physical Sciences
Engineering, Electrical & Electronic
Materials Science, Multidisciplinary
Physics, Condensed Matter
Engineering
Materials Science
Physics
Copper thiocyanate
Hole transport
Transparent semiconductor
Solar cells
OLEDs
Transistors
Hole mobility
Applied Physics
Condensed Matter Physics
Materials Engineering
Publication Status: Published
Article Number: ARTN 104002
Appears in Collections:Physics
Experimental Solid State
Faculty of Natural Sciences