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3D-MID Technology for surface modification of polymer-based composites: a comprehensive review

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Title: 3D-MID Technology for surface modification of polymer-based composites: a comprehensive review
Authors: Tengsuthiwat, J
Rangappa, SM
Siengchin, S
Pruncu, C
Item Type: Journal Article
Abstract: The three-dimensional molded interconnected device (3D-MID) has received considerable attention because of the growing demand for greater functionality and miniaturization of electronic parts. Polymer based composite are the primary choice to be used as substrate. These materials enable flexibility in production from macro to micro-MID products, high fracture toughness when subjected to mechanical loading, and they are lightweight. This survey proposes a detailed review of different types of 3D-MID modules, also presents the requirement criteria for manufacture a polymer substrate and the main surface modification techniques used to enhance the polymer substrate. The findings presented here allow to fundamentally understand the concept of 3D-MID, which can be used to manufacture a novel polymer composite substrate.
Issue Date: 23-Jun-2020
Date of Acceptance: 18-Jun-2020
URI: http://hdl.handle.net/10044/1/81046
DOI: 10.3390/polym12061408
ISSN: 2073-4360
Publisher: MDPI AG
Journal / Book Title: Polymers
Volume: 12
Issue: 6
Copyright Statement: © 2020 The authors. This is an open access article distributed under the Creative Commons Attribution License (https://creativecommons.org/licenses/by/4.0/) which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited
Keywords: 3D-MID technology
composites
polymer
surface modification
03 Chemical Sciences
09 Engineering
Publication Status: Published
Article Number: 1408
Online Publication Date: 2020-06-23
Appears in Collections:Mechanical Engineering



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