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3D-MID Technology for surface modification of polymer-based composites: a comprehensive review
File | Description | Size | Format | |
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polymers-12-01408-v2.pdf | Published version | 3.69 MB | Adobe PDF | View/Open |
Title: | 3D-MID Technology for surface modification of polymer-based composites: a comprehensive review |
Authors: | Tengsuthiwat, J Rangappa, SM Siengchin, S Pruncu, C |
Item Type: | Journal Article |
Abstract: | The three-dimensional molded interconnected device (3D-MID) has received considerable attention because of the growing demand for greater functionality and miniaturization of electronic parts. Polymer based composite are the primary choice to be used as substrate. These materials enable flexibility in production from macro to micro-MID products, high fracture toughness when subjected to mechanical loading, and they are lightweight. This survey proposes a detailed review of different types of 3D-MID modules, also presents the requirement criteria for manufacture a polymer substrate and the main surface modification techniques used to enhance the polymer substrate. The findings presented here allow to fundamentally understand the concept of 3D-MID, which can be used to manufacture a novel polymer composite substrate. |
Issue Date: | 23-Jun-2020 |
Date of Acceptance: | 18-Jun-2020 |
URI: | http://hdl.handle.net/10044/1/81046 |
DOI: | 10.3390/polym12061408 |
ISSN: | 2073-4360 |
Publisher: | MDPI AG |
Journal / Book Title: | Polymers |
Volume: | 12 |
Issue: | 6 |
Copyright Statement: | © 2020 The authors. This is an open access article distributed under the Creative Commons Attribution License (https://creativecommons.org/licenses/by/4.0/) which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited |
Keywords: | 3D-MID technology composites polymer surface modification 03 Chemical Sciences 09 Engineering |
Publication Status: | Published |
Article Number: | 1408 |
Online Publication Date: | 2020-06-23 |
Appears in Collections: | Mechanical Engineering |
This item is licensed under a Creative Commons License