Laser-assisted bumping for flip chip assembly

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Title: Laser-assisted bumping for flip chip assembly
Authors: Wang, CH
Holmes, AS
Item Type: Journal Article
Content Version: Published version
Issue Date: 1-Apr-2001
Citation: IEEE T ELECTRON PA M Vol.( 24 ) No.( 2 ) pp 109 - 114
URI: http://hdl.handle.net/10044/1/701
Publisher Link: http://dx.doi.org/10.1109/6104.930961
Start Page: 109
End Page: 114
Copyright Statement: © 2001 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.
Volume: 24
Appears in Collections:Optical and Semiconductor Devices



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