Laser-assisted Bump Transfer for Flip Chip Assembly

Title:	Laser-assisted Bump Transfer for Flip Chip Assembly
Authors:	Wang,C.H. Holmes,A.S. Gao,S.
Item Type:	Conference Paper
Content Version:	Published version
Issue Date:	31-Dec-2000
URI:	http://hdl.handle.net/10044/1/700
Publisher Link:	http://dx.doi.org/10.1109/EMAP.2000.904137
Presented At:	International Symposium on Electronic Materials and Packaging 2000 (EMAP2000), Hong Kong
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Appears in Collections:	Optical and Semiconductor Devices