Investigation of a Low Cost Solder Bumping Technique for Flip-chip Interconnection

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Title: Investigation of a Low Cost Solder Bumping Technique for Flip-chip Interconnection
Authors: Hutt,D.A.
Item Type: Conference Paper
Content Version: Published version
Issue Date: 31-Dec-1999
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Presented At: 24th International Electronics Manufacturing Technology Symposium, Austin, Texas, 18-19 October 1999
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Appears in Collections:Optical and Semiconductor Devices

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