Investigation of a Low Cost Solder Bumping Technique for Flip-chip Interconnection

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Title: Investigation of a Low Cost Solder Bumping Technique for Flip-chip Interconnection
Authors: Hutt,D.A.
Rhodes,D.G.
Conway,P.P.
Mannan,S.H.
Whalley,D.C.
Holmes,A.S.
Item Type: Conference Paper
Content Version: Published version
Issue Date: 31-Dec-1999
URI: http://hdl.handle.net/10044/1/699
Publisher Link: http://dx.doi.org/10.1109/IEMT.1999.804842
Presented At: 24th International Electronics Manufacturing Technology Symposium, Austin, Texas, 18-19 October 1999
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Appears in Collections:Optical and Semiconductor Devices



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