Investigation of a Low Cost Solder Bumping Technique for Flip-chip Interconnection

Title:	Investigation of a Low Cost Solder Bumping Technique for Flip-chip Interconnection
Authors:	Hutt,D.A. Rhodes,D.G. Conway,P.P. Mannan,S.H. Whalley,D.C. Holmes,A.S.
Item Type:	Conference Paper
Content Version:	Published version
Issue Date:	31-Dec-1999
URI:	http://hdl.handle.net/10044/1/699
Publisher Link:	http://dx.doi.org/10.1109/IEMT.1999.804842
Presented At:	24th International Electronics Manufacturing Technology Symposium, Austin, Texas, 18-19 October 1999
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Appears in Collections:	Optical and Semiconductor Devices