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Defects, dopants and Mg diffusion in MgTiO3
File | Description | Size | Format | |
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ESI_MgTiO.docx | Supporting information | 24.76 kB | Microsoft Word | View/Open |
s41598-019-40878-y.pdf | Published version | 3.04 MB | Adobe PDF | View/Open |
Title: | Defects, dopants and Mg diffusion in MgTiO3 |
Authors: | Kuganathan, N Iyngaran, P Vovk, R Chroneos, A |
Item Type: | Journal Article |
Abstract: | Magnesium titanate is technologically important due to its excellent dielectric properties required in wireless communication system. Using atomistic simulation based on the classical pair potentials we study the defect chemistry, Mg and O diffusion and a variety of dopant incorporation at Mg and Ti sites. The defect calculations suggest that cation anti-site defect is the most favourable defect process. The Mg Frenkel is the second most favourable intrinsic defect though the formation energy is highly endoergic. Higher overall activation energies (>3 eV) are observed for oxygen migration compared to those observed for magnesium (0.88 eV). Dopant substitution energies for a range of cations with charges varying from +2 to +4 were examined. Divalent dopants (Mn2+, Fe2+, Co2+, Ca2+ and Zn2+) on the Mg site exhibit low solution energies. Trivalent dopants prefer to occupy Mg site though their solution energies are high. Exothermic solution energies calculated for tetravalent dopants (Ge4+ and Si4+) on the Ti site suggest the necessity of experimental verification. |
Issue Date: | 13-Mar-2019 |
Date of Acceptance: | 25-Feb-2019 |
URI: | http://hdl.handle.net/10044/1/68079 |
DOI: | https://dx.doi.org/10.1038/s41598-019-40878-y |
ISSN: | 2045-2322 |
Publisher: | Nature Publishing Group |
Journal / Book Title: | Scientific Reports |
Volume: | 9 |
Copyright Statement: | © The Author(s) 2019. This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Cre-ative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not per-mitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/. |
Publication Status: | Published |
Article Number: | ARTN 4394 |
Appears in Collections: | Materials Faculty of Engineering |