Advances in electronic interconnection materials

Title:	Advances in electronic interconnection materials
Authors:	Gourlay, CM Arfaei, B
Item Type:	Journal Article
Issue Date:	1-Jan-2018
Date of Acceptance:	24-Nov-2018
URI:	http://hdl.handle.net/10044/1/65424
DOI:	https://dx.doi.org/10.1007/s11837-018-3267-4
ISSN:	1047-4838
Publisher:	Springer
Start Page:	131
End Page:	132
Journal / Book Title:	JOM
Volume:	71
Issue:	1
Copyright Statement:	© 2018 The Author(s). This article is distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution, and reproduction in any medium, provided you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made.
Sponsor/Funder:	Engineering & Physical Science Research Council (EPSRC) Nihon Superior Co Ltd Engineering & Physical Science Research Council (EPSRC)
Funder's Grant Number:	EP/M002241/1 N/A EP/R018863/1
Keywords:	0913 Mechanical Engineering 0914 Resources Engineering And Extractive Metallurgy 0912 Materials Engineering Materials
Publication Status:	Published
Online Publication Date:	2018-12-05
Appears in Collections:	Materials Faculty of Natural Sciences Faculty of Engineering