Properties and applications of copper(I) thiocyanate hole-transport interlayers processed from different solvents
Author(s)
Type
Journal Article
Abstract
Copper(I) thiocyanate (CuSCN) is an effective interlayer material for hole injection and transport in organic electronic devices but its solution processing has conventionally utilized undesirable di-n-alkyl sulfide solvents such as diethyl- (DES) and dipropyl-sulfide (DPS). Herein, this paper reports on the use of N,N-dimethylformamide (DMF) and 1-methyl-2-pyrrolidinone (NMP) as alternative solvents for CuSCN interlayers and performs a detailed comparison of the resulting properties relative to films processed from DES and DPS and two other recent alternatives, dimethyl sulfoxide (DMSO) and ammonium hydroxide. The surface roughness, polymorphism, and surface chemistry of the resulting CuSCN layers are reported. The interlayer surface energy and ionization potential that are key to the overlying semiconductor microstructure and interfacial energy barrier, and hence to charge transport and injection, are also discussed. Finally, systematic device tests using well-known organic semiconductors in light-emitting diode, solar cell and field-effect transistor structures demonstrate the overall suitability of DMSO and DMF as solvents for CuSCN interlayer deposition to achieve better device performance. This study broadens the applicability of CuSCN as a highly efficient hole injection/transport material for organic semiconductor devices by expanding the documented range of suitable CuSCN solvents.
Date Issued
2022-07-01
Date Acceptance
2022-03-01
Citation
Advanced Electronic Materials, 2022, 8 (7)
ISSN
2199-160X
Publisher
Wiley-VCH
Journal / Book Title
Advanced Electronic Materials
Volume
8
Issue
7
Copyright Statement
© 2022 The Authors. Advanced Electronic Materials published by Wiley-VCH GmbH This is an open access article under the terms of the Creative Commons Attribution-NonCommercial-NoDerivs License, which permits use and distribution in any medium, provided the original work is properly cited, the use is non-commercial and no modifications or adaptations are made.
Subjects
copper(I) thiocyanate
CUSCN
device performance
EFFICIENCY
FILMS
hole-transport interlayers
INJECTION
LAYERS
LIGHT-EMITTING-DIODES
Materials Science
Materials Science, Multidisciplinary
Nanoscience & Nanotechnology
organic electronics
OXIDATION
OXIDE
Physical Sciences
Physics
Physics, Applied
Science & Technology
Science & Technology - Other Topics
SOLAR-CELLS
solvent effects on CuSCN properties
Technology
WORK-FUNCTIONS
Publication Status
Published
Article Number
2101253
Date Publish Online
2022-03-18