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The Role of Lengthscale in the Creep of Sn-3Ag-0.5Cu Solder Microstructures

DOI: https://doi.org/10.5281/zenodo.4428304
Title: The Role of Lengthscale in the Creep of Sn-3Ag-0.5Cu Solder Microstructures
Authors: Gu, T
Britton, T
Gourlay, CM
Item Type: Dataset
Abstract: The data released here is for the paper "The Role of Lengthscale in the Creep of Sn-3Ag-0.5Cu Solder Microstructures". DOI: : 10.1007/s11664-020-08697-4 Tianhong Gu1*, Christopher M. Gourlay1, and T. Ben Britton1 Department of Materials, Imperial College London, SW7 2AZ. UK *Corresponding author: t.gu15@imperial.ac.uk, +44 20 7594 2634 *.bcf = Bruker BCF data for full EBSD map to plot EBSD maps *xlsx. = spreadsheet of graphical data for plots in Fig2 and Fig 4 (creep curves) *.tif = images used to to build up Figures (the figures are presented in the powerpoint) The data bundle was prepared by Tianhong Gu
Content Version: 1
Issue Date: 8-Jan-2021
URI: http://hdl.handle.net/10044/1/107382
DOI: https://doi.org/10.5281/zenodo.4428304
Copyright Statement: https://creativecommons.org/licenses/by/4.0/legalcode
Referenced By: https://doi.org/10.1007/s11664-020-08697-4
Keywords: Pb-free solder
Recrystallisation
Microstructure evolution
DIC
Appears in Collections:Faculty of Natural Sciences - Research Data