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Results 1-10 of 11
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Issue DateTitleAuthor(s)
1-Apr-2018Copper (I) selenocyanate (CuSeCN) as a novel hole-transport layer for transistors, organic solar cells, and light-emitting diodesWijeyasinghe, N; Tsetseris, L; Regoutz, A; Sit, WY; Fei, Z, et al
17-Aug-2016Analysis of Schottky Contact Formation in Coplanar Au/ZnO/Al Nanogap Radio Frequency Diodes Processed from Solution at Low TemperatureSemple, J; Rossbauer, S; Anthopoulos, TD; Commission of the European Communities; Engineering & Physical Science Research Council (E
25-Feb-2016Radio Frequency Coplanar ZnO Schottky Nanodiodes Processed from Solution on Plastic Substrates.Semple, J; Rossbauer, S; Burgess, CH; Zhao, K; Jagadamma, LK, et al
19-Nov-2015Hybrid Light-Emitting Transistors Based on Low-Temperature Solution-Processed Metal Oxides and a Charge-Injecting InterlayerUllah, M; Lin, Y-H; Muhieddine, K; Lo, S-C; Anthopoulos, TD, et al
2-Feb-2016Energy quantization in solution-processed layers of indium oxide and their application in resonant tunneling diodesLabram, JG; Treat, ND; Lin, Y-H; Burgess, CH; McLachlan, MA, et al
1-Nov-2017Sub-second photonic processing of solution-deposited single layer and heterojunction metal oxide thin-film transistors using a high-power xenon flash lampTetzner, K; Lin, Y-H; Regoutz, A; Seitkhan, A; Payne, DJ, et al
19-Oct-2015Using Molecular Design to Increase Hole Transport: Backbone Fluorination in the Benchmark Material Poly(2,5-bis(3-alkylthiophen-2-yl)thieno[3,2-b]-thiophene (pBTTT)Boufflet, P; Han, Y; Fei, Z; Treat, ND; Li, R, et al
26-May-2015High Electron Mobility Thin-Film Transistors Based on Solution-Processed Semiconducting Metal Oxide Heterojunctions and Quasi-SuperlatticesLin, Y-H; Faber, H; Labram, JG; Stratakis, E; Sygellou, L, et al
31-Mar-2017Heterojunction oxide thin-film transistors with unprecedented electron mobility grown from solution.Faber, H; Das, S; Lin, Y-H; Pliatsikas, N; Zhao, K, et al
6-Dec-2017Deep Ultraviolet Copper(I) Thiocyanate (CuSCN) Photodetectors Based on Coplanar Nanogap Electrodes Fabricated via Adhesion Lithography.Wyatt-Moon, G; Georgiadou, DG; Semple, J; Anthopoulos, TD; Commission of the European Communities