Smart patch repair with low profile PVDF sensors

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Title: Smart patch repair with low profile PVDF sensors
Authors: Lambinet, F
Khodaei, ZS
Item Type: Conference Paper
Abstract: Bonded repair of composite structures still remains a major concern for the airworthiness authorities because of the uncertainty about the repair quality. This work, investigates the applicability of conventional Structural Health Monitoring (SHM) techniques for monitoring of bonded repair with ring-shaped low profile sensors. A repaired composite panel has been sensorized with two Ring-Shaped Polyvinylidene fluoride piezopolymer Sensors (RSPS) and a piezoelectric (PZT) transducer. An electromechanical impedance (EMI) and Lamb wave analysis have been carried out to check the sensitivity of these sensors to detect an artificially introduced damage simulating a disbond of the repair. The state of the repair have been successfully monitored and reported by both methods.
Issue Date: 1-Jan-2017
Date of Acceptance: 18-Jul-2017
URI: http://hdl.handle.net/10044/1/62834
DOI: https://dx.doi.org/10.4028/www.scientific.net/KEM.754.359
ISBN: 9783035711684
ISSN: 1013-9826
Publisher: Trans Tech Publications
Start Page: 359
End Page: 362
Journal / Book Title: Key Engineering Materials
Volume: 754
Copyright Statement: © 2017 Trans Tech Publications.
Sponsor/Funder: Clean Sky Joint Undertaking
Funder's Grant Number: 671435
Conference Name: International Conference on Fracture and Damage Mechanics (FDM 2017)
Keywords: 09 Engineering
Materials
Publication Status: Published
Start Date: 2018-07-18
Finish Date: 2018-07-20
Conference Place: Florence, Italy
Online Publication Date: 2017-09
Appears in Collections:Faculty of Engineering
Aeronautics



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