Hermetic packaging for implantable microsystems: effectiveness of sequentially electroplated AuSn alloy

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Title: Hermetic packaging for implantable microsystems: effectiveness of sequentially electroplated AuSn alloy
Authors: Szostak, KM
Constandinou, TG
Item Type: Conference Paper
Abstract: With modern microtechnology, there is an aggressive miniaturization of smart devices, despite an increasing level of integration and overall complexity. It is therefore becoming increasingly important to be achieve reliable, compact packaging. For implantable medical devices (IMDs), the package must additionally provide a high quality hermetic environment to protect the device from the human body. For chip-scale devices, AuSn eutectic bonding offers the possibility of forming compact seals that achieve ultra-low permeability. A key feature is this can be achieved at process temperatures of below 350 C, therefore allowing for the integration of sensors and microsystems with CMOS electronics within a single package. Issues however such as solder wetting, void formation and controlling composition make formation of high-quality repeatable seals highly challenging. Towards this aim, this paper presents our experimental work characterizing the eutectic stack deposition. We detail our design methods and process flow, share our experiences in controlling electrochemical deposition of AuSn alloy and finally discuss usability of sequential electroplating process for the formation of hermetic eutectic bonds.
Issue Date: 17-Jul-2018
Date of Acceptance: 7-Apr-2018
URI: http://hdl.handle.net/10044/1/58747
Publisher: IEEE
Copyright Statement: This paper is embargoed until publication.
Sponsor/Funder: Engineering & Physical Science Research Council (EPSRC)
Funder's Grant Number: EP/M020975/1
Conference Name: 40th International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)
Publication Status: Accepted
Start Date: 2018-07-17
Finish Date: 2018-07-21
Conference Place: Honolulu, Hawaii
Embargo Date: publication subject to indefinite embargo
Appears in Collections:Faculty of Engineering
Electrical and Electronic Engineering



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