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Predicting mood from digital footprints using frequent sequential context patterns features

Title: Predicting mood from digital footprints using frequent sequential context patterns features
Authors: Alibasa, MJ
Calvo, RA
Yacef, K
Item Type: Journal Article
Abstract: Understanding the relationship between technology and wellbeing is important in order to raise awareness and to improve interaction designs with digital technologies. Most studies used the time spent and frequency information of digital technology usage, very few explored the sequences and the patterns of how the activity occurs. We introduce the concept of “digital context,” a representation of activity data occurring in a short time-window. Using data from our study, we determined whether: (1) there are digital context patterns that are more frequent in a particular mood compared to other moods; and (2) in the case such patterns exist, whether they can be used to improve the performance of mood prediction models. Our results showed that a mood prediction model that include digital context features yielded an accuracy of 77.8%, which is an improvement compared with the models proposed in past studies.
Issue Date: 1-Jun-2023
Date of Acceptance: 27-Apr-2022
URI: http://hdl.handle.net/10044/1/98211
DOI: 10.1080/10447318.2022.2073321
ISSN: 1044-7318
Publisher: Taylor and Francis
Start Page: 2061
End Page: 2075
Journal / Book Title: International Journal of Human-Computer Interaction
Volume: 39
Issue: 10
Copyright Statement: © 2022 The Author(s). Published with license by Taylor & Francis Group, LLC This is an Open Access article distributed under the terms of the Creative Commons Attribution-NonCommercial-NoDerivatives License (http://creativecommons.org/licenses/by-nc-nd/4.0/), which permits non-commercial re-use, distribution, and reproduction in any medium, provided the original work is properly cited, and is not altered, transformed, or built upon in any way.
Publication Status: Published
Online Publication Date: 2022-06-14
Appears in Collections:Dyson School of Design Engineering
Faculty of Engineering



This item is licensed under a Creative Commons License Creative Commons