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A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints
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1-s2.0-S0749641922000900-main.pdf | Published version | 12.3 MB | Adobe PDF | View/Open |
Title: | A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints |
Authors: | Xu, Y Xian, J Stoyanov, S Bailey, C Coyle, R Gourlay, C Dunne, F |
Item Type: | Journal Article |
Abstract: | This paper presents a multi-scale modelling approach to investigate the underpinning mechanisms of microstructure-sensitive damage of single crystal Sn-3Ag-0.5Cu (wt%, SAC305) solder joints of a Ball Grid Array (BGA) board assembly subject to thermal cycling. The multi-scale scheme couples board-scale modelling at the continuum macro-scale and individual solder modelling at the crystal micro-scale. Systematic studies of tin crystal orientation and its role in fatigue damage have been compared to experimental observations. Crystallographic orientation is examined with respect to damage development, providing evidence-based optimal solder microstructural design for in-service thermomechanical fatigue. |
Issue Date: | 1-Aug-2022 |
Date of Acceptance: | 11-Apr-2022 |
URI: | http://hdl.handle.net/10044/1/97049 |
DOI: | 10.1016/j.ijplas.2022.103308 |
ISSN: | 0749-6419 |
Publisher: | Elsevier |
Journal / Book Title: | International Journal of Plasticity |
Volume: | 155 |
Copyright Statement: | © 2022 The Author(s). Published by Elsevier Ltd. This is an open access article under the CC BY license (http://creativecommons.org/licenses/by/4.0/) |
Sponsor/Funder: | Engineering & Physical Science Research Council (EPSRC) |
Funder's Grant Number: | EP/R018863/1 |
Keywords: | 0905 Civil Engineering 0912 Materials Engineering 0913 Mechanical Engineering Mechanical Engineering & Transports |
Publication Status: | Published |
Article Number: | ARTN 103308 |
Online Publication Date: | 2022-04-13 |
Appears in Collections: | Materials Faculty of Natural Sciences |
This item is licensed under a Creative Commons License