45
IRUS Total
Downloads
  Altmetric

A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints

File Description SizeFormat 
1-s2.0-S0749641922000900-main.pdfPublished version12.3 MBAdobe PDFView/Open
Title: A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints
Authors: Xu, Y
Xian, J
Stoyanov, S
Bailey, C
Coyle, R
Gourlay, C
Dunne, F
Item Type: Journal Article
Abstract: This paper presents a multi-scale modelling approach to investigate the underpinning mechanisms of microstructure-sensitive damage of single crystal Sn-3Ag-0.5Cu (wt%, SAC305) solder joints of a Ball Grid Array (BGA) board assembly subject to thermal cycling. The multi-scale scheme couples board-scale modelling at the continuum macro-scale and individual solder modelling at the crystal micro-scale. Systematic studies of tin crystal orientation and its role in fatigue damage have been compared to experimental observations. Crystallographic orientation is examined with respect to damage development, providing evidence-based optimal solder microstructural design for in-service thermomechanical fatigue.
Issue Date: 1-Aug-2022
Date of Acceptance: 11-Apr-2022
URI: http://hdl.handle.net/10044/1/97049
DOI: 10.1016/j.ijplas.2022.103308
ISSN: 0749-6419
Publisher: Elsevier
Journal / Book Title: International Journal of Plasticity
Volume: 155
Copyright Statement: © 2022 The Author(s). Published by Elsevier Ltd. This is an open access article under the CC BY license (http://creativecommons.org/licenses/by/4.0/)
Sponsor/Funder: Engineering & Physical Science Research Council (EPSRC)
Funder's Grant Number: EP/R018863/1
Keywords: 0905 Civil Engineering
0912 Materials Engineering
0913 Mechanical Engineering
Mechanical Engineering & Transports
Publication Status: Published
Article Number: ARTN 103308
Online Publication Date: 2022-04-13
Appears in Collections:Materials
Faculty of Natural Sciences



This item is licensed under a Creative Commons License Creative Commons