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A nanoscale analysis method to reveal oxygen exchange between environment, oxide, and electrodes in ReRAM devices
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5.0070046.pdf | Published version | 8.18 MB | Adobe PDF | View/Open |
Title: | A nanoscale analysis method to reveal oxygen exchange between environment, oxide, and electrodes in ReRAM devices |
Authors: | Cox, HRJ Buckwell, M Ng, WH Mannion, DJ Mehonic, A Shearing, PR Fearn, S Kenyon, AJ |
Item Type: | Journal Article |
Abstract: | The limited sensitivity of existing analysis techniques at the nanometer scale makes it challenging to systematically examine the complex interactions in redox-based resistive random access memory (ReRAM) devices. To test models of oxygen movement in ReRAM devices beyond what has previously been possible, we present a new nanoscale analysis method. Harnessing the power of secondary ion mass spectrometry, the most sensitive surface analysis technique, for the first time, we observe the movement of 16O across electrically biased SiOx ReRAM stacks. We can therefore measure bulk concentration changes in a continuous profile with unprecedented sensitivity. This reveals the nanoscale details of the reversible field-driven exchange of oxygen across the ReRAM stack. Both the reservoir-like behavior of a Mo electrode and the injection of oxygen into the surface of SiOx from the ambient are observed within one profile. The injection of oxygen is controllable through changing the porosity of the SiOx layer. Modeling of the electric fields in the ReRAM stacks is carried out which, for the first time, uses real measurements of both the interface roughness and electrode porosity. This supports our findings helping to explain how and where oxygen from ambient moisture enters devices during operation. |
Issue Date: | 1-Nov-2021 |
Date of Acceptance: | 24-Oct-2021 |
URI: | http://hdl.handle.net/10044/1/92847 |
DOI: | 10.1063/5.0070046 |
Publisher: | AIP Publishing |
Start Page: | 111109 |
End Page: | 111109 |
Journal / Book Title: | APL Materials |
Volume: | 9 |
Issue: | 11 |
Copyright Statement: | © 2021 Author(s). All article content, except where otherwise noted, is licensed under a Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/). https://doi.org/10.1063/5.0070046 |
Keywords: | 0906 Electrical and Electronic Engineering 0912 Materials Engineering 0913 Mechanical Engineering |
Publication Status: | Published |
Online Publication Date: | 2021-11-09 |
Appears in Collections: | Materials |