In-situ study of creep in Sn-3Ag-0.5Cu solder

Abstract

The data released here is for the paper "In-situ study of creep in Sn-3Ag-0.5Cu solder". DOI: 10.1016/j.actamat.2020.06.013

Tianhong Gu1*, Vivian S. Tong1,2, Christopher M. Gourlay1, and T. Ben Britton1

Department of Materials, Imperial College London, SW7 2AZ. UK Now at: National Physical Laboratory, Hampton Rd, Teddington TW11 0LW, UK *Corresponding author: t.gu15@imperial.ac.uk, +44 20 7594 2634

*.bcf = Bruker BCF data for full EBSD map to plot EBSD maps *.csv = spreadsheet of graphical data for plots in Fig2 (creep curves), Fig10 and Fig11 (Schmid factors and slip systems) *.tif = images used to to build up Figures (the figures are presented in the powerpoint)

The data bundle was prepared by Tianhong Gu

The data released here is for the paper "In-situ study of creep in Sn-3Ag-0.5Cu solder". DOI: 10.1016/j.actamat.2020.06.013 Tianhong Gu1*, Vivian S. Tong1,2, Christopher M. Gourlay1, and T. Ben Britton1 Department of Materials, Imperial College London, SW7 2AZ. UK Now at: National Physical Laboratory, Hampton Rd, Teddington TW11 0LW, UK *Corresponding author: t.gu15@imperial.ac.uk, +44 20 7594 2634 *.bcf = Bruker BCF data for full EBSD map to plot EBSD maps *.csv = spreadsheet of graphical data for plots in Fig2 (creep curves), Fig10 and Fig11 (Schmid factors and slip systems) *.tif = images used to to build up Figures (the figures are presented in the powerpoint) The data bundle was prepared by Tianhong Gu