Towards a distributed, chronically-implantable neural interface

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Title: Towards a distributed, chronically-implantable neural interface
Authors: Ahmadi, N
Cavuto, ML
Feng, P
Leene, LB
Maslik, M
Mazza, F
Savolainen, O
Szostak, KM
Bouganis, C-S
Ekanayake, J
Jackson, A
Constandinou, TG
Item Type: Conference Paper
Abstract: We present a platform technology encompassing a family of innovations that together aim to tackle key challenges with existing implantable brain machine interfaces. The ENGINI (Empowering Next Generation Implantable Neural Interfaces) platform utilizes a 3-tier network (external processor, cranial transponder, intracortical probes) to inductively couple power to, and communicate data from, a distributed array of freely-floating mm-scale probes. Novel features integrated into each probe include: (1) an array of niobium microwires for observing local field potentials (LFPs) along the cortical column; (2) ultra-low power instrumentation for signal acquisition and data reduction; (3) an autonomous, self-calibrating wireless transceiver for receiving power and transmitting data; and (4) a hermetically-sealed micropackage suitable for chronic use. We are additionally engineering a surgical tool, to facilitate manual and robot-assisted insertion, within a streamlined neurosurgical workflow. Ongoing work is focused on system integration and preclinical testing.
Issue Date: 20-May-2019
Date of Acceptance: 20-Mar-2019
URI: http://hdl.handle.net/10044/1/66948
DOI: https://dx.doi.org/10.1109/NER.2019.8716998
ISBN: 9781538679210
ISSN: 1948-3546
Publisher: IEEE
Start Page: 719
End Page: 724
Journal / Book Title: 2019 9th international IEEE/EMBS conference on neural engineering (NER)
Replaces: 10044/1/71237
http://hdl.handle.net/10044/1/71237
Copyright Statement: © 2019, IEEE. This work is licensed under a Creative Commons Attribution 3.0 License. For more information, see http://creativecommons.org/licenses/by/3.0/
Sponsor/Funder: Engineering & Physical Science Research Council (EPSRC)
Funder's Grant Number: EP/M020975/1
Conference Name: 9th IEEE/EMBS International Conference on Neural Engineering (NER)
Keywords: Science & Technology
Technology
Life Sciences & Biomedicine
Engineering, Biomedical
Neurosciences
Engineering
Neurosciences & Neurology
Science & Technology
Technology
Life Sciences & Biomedicine
Engineering, Biomedical
Neurosciences
Engineering
Neurosciences & Neurology
Publication Status: Published
Start Date: 2019-03-20
Finish Date: 2019-03-23
Conference Place: San Francisco, CA, United States
Online Publication Date: 2019-05-20
Appears in Collections:Electrical and Electronic Engineering
Faculty of Engineering