Harnessing heterogeneous nucleation to control tin orientations in electronic interconnections

File Description SizeFormat 
s41467-017-01727-6.pdfPublished version5.2 MBAdobe PDFView/Open
Title: Harnessing heterogeneous nucleation to control tin orientations in electronic interconnections
Authors: Ma, ZL
Belyakov, SA
Sweatman, K
Nishimura, T
Nishimura, T
Gourlay, C
Item Type: Journal Article
Abstract: While many aspects of electronics manufacturing are controlled with great precision, the nucleation of tin in solder joints is currently left to chance. This leads to a widely varying melt undercooling and different crystal orientations in each joint which results in a different resistance to electromigration, thermomechanical fatigue and other failure modes in each joint. Here we identify a family of nucleants for tin, prove their effectiveness using a novel droplet solidification technique, and demonstrate an approach to incorporate the nucleants into solder joints to control the orientation of the tin nucleation event. With this approach, it is possible to change tin nucleation from a stochastic to a deterministic process, and to generate single crystal joints with their c-axis orientation tailored to best combat a selected failure mode.
Issue Date: 4-Dec-2017
Date of Acceptance: 12-Oct-2017
URI: http://hdl.handle.net/10044/1/52423
DOI: https://dx.doi.org/10.1038/s41467-017-01727-6
ISSN: 2041-1723
Publisher: Nature Publishing Group
Journal / Book Title: Nature Communications
Volume: 8
Copyright Statement: This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/ licenses/by/4.0/. © The Author(s) 2017
Sponsor/Funder: Nihon Superior Co Ltd
Engineering & Physical Science Research Council (EPSRC)
Funder's Grant Number: N/A
Keywords: MD Multidisciplinary
Publication Status: Published
Open Access location: http://rdcu.be/AhUy
Article Number: 1916
Appears in Collections:Faculty of Engineering
Faculty of Natural Sciences

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

Creative Commons