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A 4-wire interface SoC for shared multi-implant power transfer and full-duplex communication

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Title: A 4-wire interface SoC for shared multi-implant power transfer and full-duplex communication
Authors: Ghoreishizadeh, S
Haci, D
Liu, Y
Constandinou, T
Item Type: Conference Paper
Abstract: This paper describes a novel system for recovering power and providing full-duplex communication over an AC-coupled 4-wire lead between active implantable devices. The target application requires a single Chest Device be connected to a Brain Implant consisting of multiple identical optrodes that record neural activity and provide closed loop optical stimulation. The interface is integrated within each optrode SoC allowing full-duplex and fully-differential communication based on Manchester encoding. The system features a head-to-chest uplink data rate (1.6 Mbps) that is higher than that of the chest-to-head downlink (100kbps) superimposed on a power carrier. On-chip power management provides an unregulated 5 V DC supply with up to 2.5 mA output current for stimulation, and a regulated 3.3 V with 60 dB PSRR for recording and logic circuits. The circuit has been implemented in a 0.35 μm CMOS technology, occupying 1.4 mm 2 silicon area, and requiring a 62.2 μA average current consumption.
Issue Date: 15-Jun-2017
Date of Acceptance: 8-Dec-2016
URI: http://hdl.handle.net/10044/1/44160
DOI: 10.1109/LASCAS.2017.7948050
ISSN: 2473-4667
Publisher: IEEE
Start Page: 49
End Page: 52
Journal / Book Title: 2017 IEEE 8th Latin American Symposium on Circuits & Systems (LASCAS)
Copyright Statement: © 2017 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
Sponsor/Funder: Imperial College London
Wellcome Trust
Funder's Grant Number: BH134389
Conference Name: IEEE Latin American symposium on Circuits and Systems (LASCAS)
Keywords: Science & Technology
Technology
Engineering, Electrical & Electronic
Engineering
TELEMETRY
CHIP
Publication Status: Published
Start Date: 2017-02-20
Finish Date: 2017-02-23
Conference Place: Bariloche, Argentina
Appears in Collections:Electrical and Electronic Engineering
Faculty of Engineering