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Controlling Bulk Cu6Sn5 Nucleation in Sn0.7Cu/Cu Joints with Al Micro-alloying

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Title: Controlling Bulk Cu6Sn5 Nucleation in Sn0.7Cu/Cu Joints with Al Micro-alloying
Authors: Xian, JW
Belyakov, SA
Gourlay, CM
Item Type: Journal Article
Abstract: We show that dilute Al additions can control the size of primary Cu6Sn5 rods in Sn-0.7Cu/Cu ball grid array joints. In Sn-0.7Cu-0.05Al/Cu joints, the number of primary Cu6Sn5 per mm2 is 7 times higher and the mean threedimensional length of rods is 4 times smaller than in Al-free Sn-0.7Cu/Cu joints, while the area fraction of primary Cu6Sn5 is similar. It is shown that epitaxial nucleation of primary Cu6Sn5 occurs on d-Cu33Al17 or c1-Cu9Al4 particles, which are stable in the Sn-0.7Cu-0.05Al melt during holding at 250C. The observed facet relationships agree well with previously determined orientation relationships between d-Cu33Al17 and Cu6Sn5 in hypereutectic SnCu-Al alloys and result in a good lattice match with<2.5% lattice mismatch on two different interfacial planes.
Issue Date: 16-Oct-2015
Date of Acceptance: 23-Sep-2015
URI: http://hdl.handle.net/10044/1/42747
DOI: https://dx.doi.org/10.1007/s11664-015-4092-y
ISSN: 1543-186X
Publisher: Springer
Start Page: 69
End Page: 78
Journal / Book Title: Journal of Electronic Materials
Volume: 45
Issue: 1
Copyright Statement: © The Minerals, Metals & Materials Society 2015.The final publication is available at Springer via http://dx.doi.org/10.1007/s11664-015-4092-y
Sponsor/Funder: Nihon Superior Co Ltd
Engineering & Physical Science Research Council (EPSRC)
Funder's Grant Number: N/A
EP/M002241/1
Keywords: Science & Technology
Technology
Physical Sciences
Engineering, Electrical & Electronic
Materials Science, Multidisciplinary
Physics, Applied
Engineering
Materials Science
Physics
Pb-free soldering
grain refinement
intermetallics
crystal growth
orientation relationship (OR)
heterogeneous nucleation
SN-CU
SOLDER ALLOYS
PHASE
ETA-CU6SN5
ADDITIONS
GROWTH
Applied Physics
0906 Electrical And Electronic Engineering
Publication Status: Published
Appears in Collections:Materials
Faculty of Engineering