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Controlling Bulk Cu6Sn5 Nucleation in Sn0.7Cu/Cu Joints with Al Micro-alloying
File | Description | Size | Format | |
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Controlling bulk Cu6Sn5 nucleation in Sn0.7Cu_Cu joints with Al micro-alloying.pdf | Accepted version | 2.35 MB | Adobe PDF | View/Open |
Title: | Controlling Bulk Cu6Sn5 Nucleation in Sn0.7Cu/Cu Joints with Al Micro-alloying |
Authors: | Xian, JW Belyakov, SA Gourlay, CM |
Item Type: | Journal Article |
Abstract: | We show that dilute Al additions can control the size of primary Cu6Sn5 rods in Sn-0.7Cu/Cu ball grid array joints. In Sn-0.7Cu-0.05Al/Cu joints, the number of primary Cu6Sn5 per mm2 is 7 times higher and the mean threedimensional length of rods is 4 times smaller than in Al-free Sn-0.7Cu/Cu joints, while the area fraction of primary Cu6Sn5 is similar. It is shown that epitaxial nucleation of primary Cu6Sn5 occurs on d-Cu33Al17 or c1-Cu9Al4 particles, which are stable in the Sn-0.7Cu-0.05Al melt during holding at 250C. The observed facet relationships agree well with previously determined orientation relationships between d-Cu33Al17 and Cu6Sn5 in hypereutectic SnCu-Al alloys and result in a good lattice match with<2.5% lattice mismatch on two different interfacial planes. |
Issue Date: | 16-Oct-2015 |
Date of Acceptance: | 23-Sep-2015 |
URI: | http://hdl.handle.net/10044/1/42747 |
DOI: | https://dx.doi.org/10.1007/s11664-015-4092-y |
ISSN: | 1543-186X |
Publisher: | Springer |
Start Page: | 69 |
End Page: | 78 |
Journal / Book Title: | Journal of Electronic Materials |
Volume: | 45 |
Issue: | 1 |
Copyright Statement: | © The Minerals, Metals & Materials Society 2015.The final publication is available at Springer via http://dx.doi.org/10.1007/s11664-015-4092-y |
Sponsor/Funder: | Nihon Superior Co Ltd Engineering & Physical Science Research Council (EPSRC) |
Funder's Grant Number: | N/A EP/M002241/1 |
Keywords: | Science & Technology Technology Physical Sciences Engineering, Electrical & Electronic Materials Science, Multidisciplinary Physics, Applied Engineering Materials Science Physics Pb-free soldering grain refinement intermetallics crystal growth orientation relationship (OR) heterogeneous nucleation SN-CU SOLDER ALLOYS PHASE ETA-CU6SN5 ADDITIONS GROWTH Applied Physics 0906 Electrical And Electronic Engineering |
Publication Status: | Published |
Appears in Collections: | Materials Faculty of Engineering |