Heterogeneous nucleation of Cu6Sn5 in Sn-Cu-Al solders

File Description SizeFormat 
Xian et al.pdfAccepted version2.59 MBAdobe PDFDownload
Title: Heterogeneous nucleation of Cu6Sn5 in Sn-Cu-Al solders
Author(s): Xian, JW
Belyakov, SA
Britton, TB
Gourlay, CM
Item Type: Journal Article
Publication Date: 15-Jan-2015
URI: http://hdl.handle.net/10044/1/19491
DOI: http://dx.doi.org/10.1016/j.jallcom.2014.08.251
ISSN: 0925-8388
Publisher: ELSEVIER SCIENCE SA
Start Page: 345
End Page: 355
Journal / Book Title: JOURNAL OF ALLOYS AND COMPOUNDS
Volume: 619
Copyright Statement: © 2014 Elsevier B.V. All rights reserved. . NOTICE: this is the author’s version of a work that was accepted for publication in Journal of Alloys and Compounds. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published in JOURNAL OF ALLOYS AND COMPOUNDS, Vol.: 619, (2015) DOI: 10.1016/j.jallcom.2014.08.251
Publication Status: Accepted
Appears in Collections:Materials



Items in Spiral are protected by copyright, with all rights reserved, unless otherwise indicated.

Creative Commons