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High-Temperature (> 500 degrees C) Wall Thickness Monitoring Using Dry-Coupled Ultrasonic Waveguide Transducers

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IEEE Transactions on Ultrasonics Ferroelectrics and Frequency Control_58_1_2011.pdfAccepted version784.4 kBAdobe PDFView/Open
Title: High-Temperature (> 500 degrees C) Wall Thickness Monitoring Using Dry-Coupled Ultrasonic Waveguide Transducers
Authors: Cegla, FB
Cawley, P
Allin, J
Davies, J
Item Type: Journal Article
Issue Date: 1-Jan-2011
URI: http://hdl.handle.net/10044/1/13851
DOI: http://dx.doi.org/10.1109/TUFFC.2011.1782
ISSN: 0885-3010
Publisher: IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Start Page: 156
End Page: 167
Journal / Book Title: IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL
Volume: 58
Issue: 1
Copyright Statement: © 2011 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
Publication Status: Published
Appears in Collections:Mechanical Engineering