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Issue DateTitleAuthor(s)
31-Dec-2005Modelling for optimisation of self-powered wireless sensor nodesMitcheson,P.D.; Yates,D.C.; Yeatman,E.M.; Green,T.C.; Holmes,A.S.
31-Dec-1999Investigation of a Low Cost Solder Bumping Technique for Flip-chip InterconnectionHutt,D.A.; Rhodes,D.G.; Conway,P.P.; Mannan,S.H.; Whalley,D.C., et al
2002Analysis of optimised micro-generator architectures for self-powered ubiquitous computersMitcheson,P.D.; Green,T.C.; Yeatman,E.M.; Holmes,A.S.
31-Dec-2000Laser-assisted Bump Transfer for Flip Chip AssemblyWang,C.H.; Holmes,A.S.; Gao,S.