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A microstructure-sensitive analytical solution for short fatigue crack growth rate in metallic materials
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SCG analytical IJMS 2023.pdf | Published version | 9.96 MB | Adobe PDF | View/Open |
Title: | A microstructure-sensitive analytical solution for short fatigue crack growth rate in metallic materials |
Authors: | Long, DJ Liu, Y Wan, W |
Item Type: | Journal Article |
Abstract: | Short fatigue crack growth in engineering alloys is among the most prominent challenges in mechanics of materials. Owing to its microstructural sensitivity, advanced and computationally expensive numerical methods are required to solve for crack growth rate. A novel mechanistic analytical model is presented, which adopts a stored energy density fracture criterion. Full-field implementation of the model in polycrystalline materials is achieved using a crystallographic crack-path prediction method based on a local stress intensity factor term. The model is applied to a range of Zircaloy-4 microstructures and demonstrates strong agreement with experimental rates and crack paths. Growth rate fluctuations across individual grains and substantial texture sensitivity are captured using the model. More broadly, this work demonstrates the benefits of mechanistic analytical modelling over conventional fracture mechanics and recent numerical approaches for accurate material performance predictions and design. Additionally, it offers a significant computer processing time reduction compared with state-of-the-art numerical methods. |
Issue Date: | 1-Sep-2023 |
Date of Acceptance: | 5-Apr-2023 |
URI: | http://hdl.handle.net/10044/1/111932 |
DOI: | 10.1016/j.ijmecsci.2023.108365 |
ISSN: | 0020-7403 |
Publisher: | Elsevier |
Journal / Book Title: | International Journal of Mechanical Sciences |
Volume: | 253 |
Copyright Statement: | © 2023 The Author(s). Published by Elsevier Ltd. This is an open access article under the CC BY license (http://creativecommons.org/licenses/by/4.0/). |
Publication Status: | Published |
Article Number: | 108365 |
Online Publication Date: | 2023-04-17 |
Appears in Collections: | Materials |
This item is licensed under a Creative Commons License