The Role of Lengthscale in the Creep of Sn-3Ag-0.5Cu Solder Microstructures
Author(s)
Gu, Tianhong
Britton, Thomas
Gourlay, Christopher M
Type
Dataset
Abstract
The data released here is for the paper "The Role of Lengthscale in the Creep of Sn-3Ag-0.5Cu Solder Microstructures". DOI: : 10.1007/s11664-020-08697-4
Tianhong Gu1*, Christopher M. Gourlay1, and T. Ben Britton1
Department of Materials, Imperial College London, SW7 2AZ. UK
*Corresponding author: t.gu15@imperial.ac.uk, +44 20 7594 2634
*.bcf = Bruker BCF data for full EBSD map to plot EBSD maps
*xlsx. = spreadsheet of graphical data for plots in Fig2 and Fig 4 (creep curves)
*.tif = images used to to build up Figures (the figures are presented in the powerpoint)
The data bundle was prepared by Tianhong Gu
Tianhong Gu1*, Christopher M. Gourlay1, and T. Ben Britton1
Department of Materials, Imperial College London, SW7 2AZ. UK
*Corresponding author: t.gu15@imperial.ac.uk, +44 20 7594 2634
*.bcf = Bruker BCF data for full EBSD map to plot EBSD maps
*xlsx. = spreadsheet of graphical data for plots in Fig2 and Fig 4 (creep curves)
*.tif = images used to to build up Figures (the figures are presented in the powerpoint)
The data bundle was prepared by Tianhong Gu
Version
1
Date Issued
2021-01-08
Citation
2021
Copyright Statement
https://creativecommons.org/licenses/by/4.0/legalcode
Is Referenced By
Subjects
Pb-free solder
Recrystallisation
Microstructure evolution
DIC