Micro motion amplification – A Review
File(s)09051731.pdf (2.23 MB)
Published version
Author(s)
Kiziroglou, M
Temelkuran, B
Yeatman, E
Yang, GZ
Type
Journal Article
Abstract
Many motion-active materials have recently emerged, with new methods of integration into actuator components and systems-on-chip. Along with established microprocessors, interconnectivity capabilities and emerging powering methods, they offer a unique opportunity for the development of interactive millimeter and micrometer scale systems with combined sensing and actuating capabilities. The amplification of nanoscale material motion to a functional range is a key requirement for motion interaction and practical applications, including medical micro-robotics, micro-vehicles and micro-motion energy harvesting. Motion amplification concepts include various types of leverage, flextensional mechanisms, unimorphs, micro-walking /micro-motor systems, and structural resonance. A review of the research state-of-art and product availability shows that the available mechanisms offer a motion gain in the range of 10. The limiting factor is the aspect ratio of the moving structure that is achievable in the microscale. Flexures offer high gains because they allow the application of input displacement in the close vicinity of an effective pivotal point. They also involve simple and monolithic fabrication methods allowing combination of multiple amplification stages. Currently, commercially available motion amplifiers can provide strokes as high as 2% of their size. The combination of high-force piezoelectric stacks or unimorph beams with compliant structure optimization methods is expected to make available a new class of high-performance motion translators for microsystems.
Date Issued
2020-03-31
Online Publication Date
2020-04-24T09:48:03Z
Date Acceptance
2020-03-02
ISSN
2169-3536
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Start Page
64037
End Page
34055
Journal / Book Title
IEEE Access
Volume
8
Copyright Statement
This work is licensed under a Creative Commons Attribution 4.0 License. For more information, see https://creativecommons.org/licenses/by/4.0/
Sponsor
Engineering & Physical Science Research Council (EPSRC)
Identifier
https://ieeexplore.ieee.org/document/9051731
Grant Number
EP/P012779/1
Subjects
08 Information and Computing Sciences
09 Engineering
10 Technology
Publication Status
Published
Date Publish Online
2020-03-31