Time-lapse imaging of Ag3Sn thermal coarsening in Sn-3Ag-0.5Cu solder joints
File(s)Xian2021_Article_Time-LapseImagingOfAg3SnTherma.pdf (2.26 MB)
Published version
Author(s)
Xian, JW
Belyakov, SA
Gourlay, CM
Type
Journal Article
Abstract
The coarsening of Ag3Sn particles occurs during the operation of joints and plays an important role in failure. Here, Ag3Sn coarsening is studied at 125°C in the eutectic regions of Sn-3Ag-0.5Cu/Cu solder joints by SEM-based time-lapse imaging. Using multi-step thresholding segmentation and image analysis, it is shown that coalescence of Ag3Sn particles is an important ripening process in addition to LSW-like Ostwald ripening. About 10% of the initial Ag3Sn particles coalesced during ageing, coalescence occurred uniformly across eutectic regions, and the scaled size distribution histograms contained large particles that can be best fit by the Takajo model of coalescence ripening. Similar macroscopic coarsening kinetics were measured between the surface and bulk Ag3Sn particles. Tracking of individual surface particles showed an interplay between the growth/shrinkage and coalescence of Ag3Sn.
Date Issued
2020-10-13
Date Acceptance
2020-09-17
Citation
Journal of Electronic Materials, 2020, 50, pp.786-795
ISSN
0361-5235
Publisher
Springer Science and Business Media LLC
Start Page
786
End Page
795
Journal / Book Title
Journal of Electronic Materials
Volume
50
Copyright Statement
© 2020 The Author(s). This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons licence, and indicate if changes were made. The images or other third party material in this article are included in the article's Creative Commons licence, unless indicated otherwise in a credit line to the material. If material is not included in the article's Creative Commons licence and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this licence, visit http://creativecommons.org/licenses/by/4.0/.
License URL
Identifier
https://link.springer.com/article/10.1007%2Fs11664-020-08498-9
Subjects
Science & Technology
Technology
Physical Sciences
Engineering, Electrical & Electronic
Materials Science, Multidisciplinary
Physics, Applied
Engineering
Materials Science
Physics
Soldering
intermetallics
precipitates
coarsening
time-lapse imaging
SN-AG
MICROSTRUCTURAL EVOLUTION
PLATE FORMATION
SILVER CONTENT
GROWTH
CREEP
RECRYSTALLIZATION
SOLIDIFICATION
NUCLEATION
BEHAVIOR
0202 Atomic, Molecular, Nuclear, Particle and Plasma Physics
0906 Electrical and Electronic Engineering
1099 Other Technology
Applied Physics
Publication Status
Published
Date Publish Online
2020-10-13