Advances in electronic interconnection materials
File(s)JOM_Gourlay-Babak.pdf (298.88 KB)
Published version
Author(s)
Gourlay, CM
Arfaei, B
Type
Journal Article
Date Issued
2019-01
Date Acceptance
2018-11-24
Citation
JOM, 2019, 71 (1), pp.131-132
ISSN
1047-4838
Publisher
Springer
Start Page
131
End Page
132
Journal / Book Title
JOM
Volume
71
Issue
1
Copyright Statement
© 2018 The Author(s). This article is distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution, and reproduction in any medium, provided you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made.
Sponsor
Engineering & Physical Science Research Council (EPSRC)
Nihon Superior Co Ltd
Engineering & Physical Science Research Council (EPSRC)
Grant Number
EP/M002241/1
N/A
EP/R018863/1
Subjects
0913 Mechanical Engineering
0914 Resources Engineering And Extractive Metallurgy
0912 Materials Engineering
Materials
Publication Status
Published
Date Publish Online
2018-12-05