Influence of Bi additions on the distinct βsn grain structure of Sn-0.7Cu-0.05Ni-xBi (x = 0-4wt%)
Author(s)
Belyakov, SA
Nishimura, T
Sweatman, K
Nogita, K
Gourlay, CM
Type
Conference Paper
Abstract
Effects of Bi additions to Ag-containing lead-free solders have been the focus of a considerable amount of past investigation. However, the influence of Bi on Sn-Cu-Ni solders has not been studied extensively. In the present study, we explore the influence of Bi on microstructure formation of Sn-0.7Cu-0.05Ni/Cu solder joints both in the bulk and at the interface. It is shown that (i) Sn-0.7Cu-0.05Ni solidifies to produce a markedly different grain structure to Ag-containing lead-free alloys, with 5-8 independent βSn grains in each joint; (ii) Bi additions to Sn-0.7Cu-0.05Ni maintain this distinct βSn grain structure and had no discernible effect on the (Cu,Ni)6Sn5 interfacial intermetallic layers or primary intermetallic crystals.
Date Issued
2016-06-09
Date Acceptance
2016-04-20
Citation
2016 International Conference on Electronics Packaging, ICEP 2016, 2016, pp.222-225
ISBN
9784904090176
Publisher
IEEE
Start Page
222
End Page
225
Journal / Book Title
2016 International Conference on Electronics Packaging, ICEP 2016
Copyright Statement
© 20xx IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
Source
ICEP 2016
Publication Status
Published
Start Date
2016-04-20
Finish Date
2016-04-22
Coverage Spatial
Sapporo, Japan