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Investigation of a Low Cost Solder Bumping Technique for Flip-cip Interconnection
File(s)
Author(s)
Hutt,D.A.
Rhodes,D.G.
Conway,P.P.
Mannan,S.H.
Whalley,D.C.
Type
Conference Paper
Version
Published version
Date Issued
1999
Citation
1999
URI
URL
Source Title
24th International Electronics Manufacturing Technology Symposium, Austin, Texas, 18-19 October 1999
Copyright Statement
© 1999 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.
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Source
24th International Electronics Manufacturing Technology Symposium, Austin, Texas, 18-19 October 1999