Laser-assisted bumping for flip chip assembly
File(s)Laser-assisted bumping for flip.pdf (188.43 KB)
Published version
Author(s)
Wang, CH
Holmes, AS
Type
Journal Article
Version
Published version
Date Issued
2001-04-01
Citation
IEEE T ELECTRON PA M Vol.( 24 ) No.( 2 ) pp 109 - 114
Start Page
109
End Page
114
Copyright Statement
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Source Volume Number
24