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  5. Analytical and DEM studies of thermal stress in granular materials
 
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Analytical and DEM studies of thermal stress in granular materials
File(s)
epjconf_pg2021_14018.pdf (550.74 KB)
Published version
OA Location
https://doi.org/10.1051/epjconf/202124914018
Author(s)
Morimoto, Tokio
O'Sullivan, Catherine
Taborda, David
Type
Conference Paper
Abstract
The ability to predict thermal-induced stresses in granular materials is of practical importance across a range of disciplines ranging from process engineering to geotechnical engineering. This study presents an analytical formula to predict thermal-induced stress increments in mono-disperse granular materials subject to an initial isotropic stress state. A complementary series of DEM simulations were carried out to explore the applicability of the proposed analytical formula. The comparative analysis showed that the proposed expression can accurately predict stress changes in packings where there are negligible particle displacements as a consequence of the thermal loading (e.g. regular packings and medium/dense random packings); however large errors were observed in loose samples with a random packing.
Date Issued
2021-06-07
Date Acceptance
2021-03-11
Citation
EPJ Web of Conferences, 2021, 249, pp.1-4
URI
http://hdl.handle.net/10044/1/91829
DOI
https://www.dx.doi.org/10.1051/epjconf/202124914018
ISSN
2100-014X
Publisher
EDP Sciences
Start Page
1
End Page
4
Journal / Book Title
EPJ Web of Conferences
Volume
249
Copyright Statement
© The Authors, published by EDP Sciences. This is an open access article distributed under the terms of the Creative Commons Attribution License 4.0 (http://creativecommons.org/licenses/by/4.0/).
License URL
http://creativecommons.org/licenses/by/4.0/
Sponsor
Commission of the European Communities
Grant Number
813202
Source
Powders and Grains 2021
Publication Status
Published
Start Date
2021-07-05
Finish Date
2021-08-06
Coverage Spatial
Buenos Aires (Virtual), Argentina
Date Publish Online
2021-06-07
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