Design and manufacture of next generation intelligent and connected devices is an
interdisciplinary research that incorporates a range of research areas, including additive
manufacturing (AM), design, human-to-computer interaction (HCI), electrical engineering
and materials science. The subject’s diversity of influence requires the cross-pollination
of knowledge and research ideas to develop and expand its applications. Contributions
to building the next generation of intelligent and connected devices will involve enhanced
automation in design and production, mass-customised manufacturing for bespoke applications, and increased accessibility of affordable and precise fabrication tools, all of
which will be key contributors to new changes in production and delivery chain of future
connected devices.
A practical strategy toward next generation device design and manufacture lies in increasing hardware and software innovations for constructing various freeform 3D printed parts
with functionalities that can be utilised as an end use product. Such innovations could
include the following:
i) Expanded multi-functionality, multi-axis and multi-material of the AM, wherein 3D
printed parts can conduct electricity, combine various materials seamlessly and be constructed in conformal layers that the printed parts have uniform structural properties on
all surfaces formed by continuous material extrusion. A multi-axis machine could also
perform assemblies such as pick and place to fully automate the manufacturing process
of electronic objects
ii) Increased availability of parametric and automated approaches to design and computation. Multi-axis 3D printing requires complex process to generate toolpaths for controlling
the printer. New developments of the design software for structural electronics and multi-
axis toolpaths generator dedicated for AM will ease the workflow and reduce the labour
intensity involved in the chain process of design to manufacturing.