Bottom-Gate Complementary Inverters on Plastic with Gravure-Printed Dielectric and Semiconductors
File(s)IEEE Trans Elec Dev_inverter paper_v1.4.pdf (1.2 MB)
Accepted version
Author(s)
Campbell, AJ
Vaklev, NL
Yang, Y
Muir, BVO
Steinke, JHG
Type
Journal Article
Abstract
Organic complementary circuitry combines all the
advantages of plastic electronics, such as flexibility, thinness and
solution-processability with low power consumption. Here we
report organic complimentary inverters fabricated in a carrierfree
batch process on plastic foil with dielectric and
semiconductor layers patterned using the high-volume gravure
contact printing technique. The transistor components have
bottom-gate, bottom-contact configuration with aluminium gates
and gold contacts, allowing full use of photolithographic
processing whilst protecting the semiconductors by depositing
them last. Cross-linkable polymer dielectric, p-type small
molecule and the n-type polymer semiconductors are printed
from inks based on non-chlorinated solvents. Printing instability
is observed for capillary numbers approaching 1. The 430 nm
thick dielectric affords relatively-low operational voltage and it is
the thinnest printed organic dielectric reported in the literature
for organic inverters to date. Both p- and n-type transistors have
a mobility of 0.01–0.04 cm2V
1
s
1
. The device parameters for the
n-type transistors show less variation than the p-type transistors,
which can be related to the more isotropic charge transport in
polymer films compared to the small-molecule polycrystalline
films. The resultant inverters have an average gain of 4.5±1.5
and a maximum gain of 8 at VDD = 20 V. The combination of
conventional photolithographic processing and gravure contact
printing can therefore be used to fabricate bottom-gate organic
complementary circuitry on plastic
advantages of plastic electronics, such as flexibility, thinness and
solution-processability with low power consumption. Here we
report organic complimentary inverters fabricated in a carrierfree
batch process on plastic foil with dielectric and
semiconductor layers patterned using the high-volume gravure
contact printing technique. The transistor components have
bottom-gate, bottom-contact configuration with aluminium gates
and gold contacts, allowing full use of photolithographic
processing whilst protecting the semiconductors by depositing
them last. Cross-linkable polymer dielectric, p-type small
molecule and the n-type polymer semiconductors are printed
from inks based on non-chlorinated solvents. Printing instability
is observed for capillary numbers approaching 1. The 430 nm
thick dielectric affords relatively-low operational voltage and it is
the thinnest printed organic dielectric reported in the literature
for organic inverters to date. Both p- and n-type transistors have
a mobility of 0.01–0.04 cm2V
1
s
1
. The device parameters for the
n-type transistors show less variation than the p-type transistors,
which can be related to the more isotropic charge transport in
polymer films compared to the small-molecule polycrystalline
films. The resultant inverters have an average gain of 4.5±1.5
and a maximum gain of 8 at VDD = 20 V. The combination of
conventional photolithographic processing and gravure contact
printing can therefore be used to fabricate bottom-gate organic
complementary circuitry on plastic
Date Issued
2015-10-13
Date Acceptance
2015-09-15
Citation
IEEE Transactions on Electron Devices, 2015, 62 (11), pp.3820-3824
ISSN
0018-9383
Publisher
IEEE
Start Page
3820
End Page
3824
Journal / Book Title
IEEE Transactions on Electron Devices
Volume
62
Issue
11
Copyright Statement
© 2015 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
Publication Status
Published