Suppression of Cu6Sn5 in TiO2 reinforced solder joints after multiple reflow cycles
File(s)
Accepted version
Author(s)
Salleh, MAAM
McDonald, SD
Gourlay, CM
Yasuda, H
Nogita, K
Type
Journal Article
Abstract
In the current generation of 3D electronic packaging, multiple reflows are often required during soldering. In addition, electronic packages may be subjected to additional solder rework or other heating processes. This paper investigates the effects of multiple reflow cycles on TiO2 reinforced Sn–0.7Cu solder fabricated by a powder metallurgy microwave sintering technique. Compared to TiO2-free equivalents, a relative suppression of the Cu6Sn5 phase, both as primary crystals and as an interfacial layer was observed. The likely mechanism relates to the TiO2 nanoparticles promoting nucleation and decreasing the amount of time that liquid is in contact with the interfacial layer. The TiO2 particles appear to stabilise the interfacial Cu6Sn5 layer and result in a more planar morphology. The suppression of Cu6Sn5 results in TiO2 reinforced solder joints having a higher shear strength after multiple reflow cycles compared to Sn–0.7Cu solder joints.
Date Issued
2016-06-30
Date Acceptance
2016-06-28
Citation
Materials & Design, 2016, 108, pp.418-428
ISSN
0261-3069
Publisher
Elsevier
Start Page
418
End Page
428
Journal / Book Title
Materials & Design
Volume
108
Copyright Statement
© 2016, Elsevier Ltd. All rights reserved. This manuscript is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International http://creativecommons.org/licenses/by-nc-nd/4.0/
Sponsor
Nihon Superior Co Ltd
Engineering & Physical Science Research Council (EPSRC)
Identifier
http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:000382793200046&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=1ba7043ffcc86c417c072aa74d649202
Grant Number
N/A
EP/M002241/1
Subjects
Science & Technology
Technology
Materials Science, Multidisciplinary
Materials Science
Lead-free solder
Intermetallic compound
Synchrotron
Multiple reflow
Shear strength
LEAD-FREE SOLDER
FREE COMPOSITE SOLDER
MECHANICAL-PROPERTIES
SHEAR-STRENGTH
INTERMETALLIC COMPOUNDS
INTERFACIAL REACTION
NANOPARTICLES ADDITION
BUMP METALLIZATION
SURFACE FINISHES
CU-SUBSTRATE
Materials
0912 Materials Engineering
0913 Mechanical Engineering
Publication Status
Published