Experimental and constitutive modelling studies of semicrystalline thermoplastics under solid-state stamp forming conditions
File(s)
Accepted version
Author(s)
Wang, Hongyan
Liu, Haibao
Ding, Zerong
Li, Nan
Type
Journal Article
Abstract
Experimental characterisation and constitutive modelling studies on the thermomechanical behaviour of thermoplastics, under solid-state stamp forming conditions, are required for understanding and optimising the stamp
forming process. In this paper, two semicrystalline thermoplastics, Polyamide 6 (PA6, or Nylon 6) and PolyEther-Ether-Ketone (PEEK) are studied via uniaxial tensile tests at temperatures between their glass transition
temperatures (Tg ) and melting temperatures (Tm), and at different strain rates (0.001–50 /s). The temperature
and strain rate effects are analysed quantitatively to further understand the thermomechanical response of these
semicrystalline thermoplastics. The results show that temperature has significant effects on the thermomechanical behaviour of thermoplastic polymers, while the strain rate effects are relatively marginal in the
investigated strain rate range. In addition, a new physically-based viscoelastic-viscoplastic constitutive model is
proposed to simulate the thermomechanical behaviour of both materials. The model shows good prediction
accuracy on tensile stress responses and provides an insight into the microstructural evolution of the semicrystalline thermoplastics; thus, it can be used to analyse solid-state stamp forming of pure semicrystalline
thermoplastics and thermoplastic polymer matrix composites (TPMCs).
forming process. In this paper, two semicrystalline thermoplastics, Polyamide 6 (PA6, or Nylon 6) and PolyEther-Ether-Ketone (PEEK) are studied via uniaxial tensile tests at temperatures between their glass transition
temperatures (Tg ) and melting temperatures (Tm), and at different strain rates (0.001–50 /s). The temperature
and strain rate effects are analysed quantitatively to further understand the thermomechanical response of these
semicrystalline thermoplastics. The results show that temperature has significant effects on the thermomechanical behaviour of thermoplastic polymers, while the strain rate effects are relatively marginal in the
investigated strain rate range. In addition, a new physically-based viscoelastic-viscoplastic constitutive model is
proposed to simulate the thermomechanical behaviour of both materials. The model shows good prediction
accuracy on tensile stress responses and provides an insight into the microstructural evolution of the semicrystalline thermoplastics; thus, it can be used to analyse solid-state stamp forming of pure semicrystalline
thermoplastics and thermoplastic polymer matrix composites (TPMCs).
Date Issued
2021-07-16
Date Acceptance
2021-06-07
Citation
Polymer, 2021, 228, pp.1-17
ISSN
0032-3861
Publisher
Elsevier BV
Start Page
1
End Page
17
Journal / Book Title
Polymer
Volume
228
Copyright Statement
© 2021 Elsevier Ltd. All rights reserved. This manuscript is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International Licence http://creativecommons.org/licenses/by-nc-nd/4.0/
Identifier
https://www.sciencedirect.com/science/article/pii/S0032386121005620?via%3Dihub
Subjects
Polymers
03 Chemical Sciences
09 Engineering
Publication Status
Published
Article Number
123939
Date Publish Online
2021-06-11