Thermosonic flip chip interconnection using electroplated copper column arrays
File(s)Thermosonic flip chip interconnection.pdf (3.75 MB)
Published version
Author(s)
Gao, S
Holmes, AS
Type
Journal Article
Version
Published version
Date Issued
2006
Citation
IEEE Transactions on Advanced Packaging, 2006, 29, pp.725-734
ISSN
1521-3323
Start Page
725
End Page
734
Journal / Book Title
IEEE Transactions on Advanced Packaging
Volume
29
Copyright Statement
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Source Volume Number
29
Article Number
4