MPCSM: microservice placement for edge-cloud collaborative smart manufacturing
File(s)MPCSM-accepted version.pdf (4.6 MB)
Accepted version
Author(s)
Type
Journal Article
Abstract
Latency-aware service placement is promising in reducing the overall service response latency of proliferating edge-cloud collaborative smart manufacturing systems. However, intuitive latency estimators used by existing service placement approaches cannot accurately depict the non-linear end-to-end (E2E) latency of multi-hop microservices with complex dependencies, which is severely hindering the effectiveness of latency-aware service placement. To address this issue, we present a Microservice Placement mechanism for edge-cloud Collaborative Smart Manufacturing (MPCSM), where a microservice placement algorithm LaECP supported by an accurate data-driven E2E latency estimation method is proposed. We build a real-world collaborative prototype, and conduct a case study on semiconductor manufacturing to elaborate the construction of our latency estimator. Results of extensive experiments demonstrate that the error of our E2E latency estimator is up to 10X less than that of existing ones, and the overall service latency with MPCSM is up to 10X less than that with existing service placement approaches.
Date Issued
2021-09-01
Date Acceptance
2020-10-24
Citation
IEEE Transactions on Industrial Informatics, 2021, 17 (9), pp.5898-5908
ISSN
1551-3203
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Start Page
5898
End Page
5908
Journal / Book Title
IEEE Transactions on Industrial Informatics
Volume
17
Issue
9
Copyright Statement
© 2020 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
Sponsor
Lloyd¿s Register Foundation
Identifier
https://ieeexplore.ieee.org/document/9250590
Grant Number
ATIPO000005051
Subjects
08 Information and Computing Sciences
09 Engineering
10 Technology
Electrical & Electronic Engineering
Publication Status
Published
Date Publish Online
2020-11-06