Simple smart implants: simultaneous monitoring of loosening and temperature in orthopaedics with an embedded ultrasound transducer
File(s)Main File - Simple Smart Implants 20210113.pdf (1.03 MB)
Accepted version
Author(s)
Hall, Thomas
Cegla, Fred
van Arkel, Richard Jan
Type
Journal Article
Abstract
Implant failure can have devastating consequences on patient outcomes following joint replacement. Time to diagnosis affects subsequent treatment success, but current diagnostics do not give early warning and lack accuracy. This research proposes an embedded ultrasound system to monitor implant fixation and temperature – a potential indicator of infection. Requiring only two implanted components: a piezoelectric transducer and a coil, pulse-echo responses are elicited via a three-coil inductive link. This passive system avoids the need for batteries, energy harvesters, and microprocessors, resulting in minimal changes to existing implant architecture. Proof-of-concept was demonstrated in vitro for a titanium plate cemented into synthetic bone, using a small embedded coil with 10 mm diameter. Gross loosening – simulated by completely debonding the implant-cement interface – was detectable with 95% confidence at up to 12 mm implantation depth. Temperature was calibrated with root mean square error of 0.19 °C at 5 mm, with measurements accurate to ±1 °C with 95% confidence up to 6 mm implantation depth. These data demonstrate that with only a transducer and coil implanted, it is possible to measure fixation and temperature simultaneously. This simple smart implant approach minimises the need to modify well-established implant designs, and hence could enable mass-market adoption.
Date Issued
2021-02
Date Acceptance
2021-01-13
Citation
IEEE Transactions on Biomedical Circuits and Systems, 2021, 15 (1), pp.102-110
ISSN
1932-4545
Publisher
Institute of Electrical and Electronics Engineers
Start Page
102
End Page
110
Journal / Book Title
IEEE Transactions on Biomedical Circuits and Systems
Volume
15
Issue
1
Copyright Statement
© 2021 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
Sponsor
Engineering & Physical Science Research Council (EPSRC)
Identifier
https://ieeexplore.ieee.org/document/9329118
Grant Number
EP/S022546/1
Subjects
Electrical & Electronic Engineering
0903 Biomedical Engineering
0906 Electrical and Electronic Engineering
Publication Status
Published
Date Publish Online
2021-01-20