In-situ study of creep in Sn-3Ag-0.5Cu solder
Author(s)
Gu, Tianhong
Tong, Vivian
Gourlay, Christopher
Britton, Ben
Type
Dataset
Abstract
The data released here is for the paper "In-situ study of creep in Sn-3Ag-0.5Cu solder". DOI: 10.1016/j.actamat.2020.06.013
Tianhong Gu1*, Vivian S. Tong1,2, Christopher M. Gourlay1, and T. Ben Britton1
Department of Materials, Imperial College London, SW7 2AZ. UK
Now at: National Physical Laboratory, Hampton Rd, Teddington TW11 0LW, UK
*Corresponding author: t.gu15@imperial.ac.uk, +44 20 7594 2634
*.bcf = Bruker BCF data for full EBSD map to plot EBSD maps
*.csv = spreadsheet of graphical data for plots in Fig2 (creep curves), Fig10 and Fig11 (Schmid factors and slip systems)
*.tif = images used to to build up Figures (the figures are presented in the powerpoint)
The data bundle was prepared by Tianhong Gu
Tianhong Gu1*, Vivian S. Tong1,2, Christopher M. Gourlay1, and T. Ben Britton1
Department of Materials, Imperial College London, SW7 2AZ. UK
Now at: National Physical Laboratory, Hampton Rd, Teddington TW11 0LW, UK
*Corresponding author: t.gu15@imperial.ac.uk, +44 20 7594 2634
*.bcf = Bruker BCF data for full EBSD map to plot EBSD maps
*.csv = spreadsheet of graphical data for plots in Fig2 (creep curves), Fig10 and Fig11 (Schmid factors and slip systems)
*.tif = images used to to build up Figures (the figures are presented in the powerpoint)
The data bundle was prepared by Tianhong Gu
Date Issued
2020-06-17
Citation
2020
Copyright Statement
https://creativecommons.org/licenses/by/4.0/legalcode
Is Referenced By
Subjects
Pb-free solder
Recrystallisation
Microstructure evolution