3-D printed rectangular waveguide 123-129 GHz packaging for commercial CMOS RFICs
File(s)2023_02_IEEE_MWTL.pdf (1.54 MB)
Published version
Author(s)
Type
Journal Article
Abstract
This work demonstrates the hybrid integration of a complementary metal–oxide–semiconductor (CMOS) radio frequency integrated circuit (RFIC) into a host 3-D printed metal-pipe rectangular waveguide (MPRWG). On-chip Vivaldi antennas are used for TE 10 -to-thin-film microstrip (TFMS) mode conversion. Our packaging solution has a combined measured insertion loss of only 1 dB/transition at 126 GHz. This unique packaging and interconnect solution opens up new opportunities for implementing low-cost subterahertz (THz) multichip modules.
Date Issued
2023-02-10
Date Acceptance
2022-11-03
Citation
IEEE Microwave and Wireless Technology Letters, 2023, 33 (2), pp.157-160
ISSN
2771-957X
Publisher
Institute of Electrical and Electronics Engineers
Start Page
157
End Page
160
Journal / Book Title
IEEE Microwave and Wireless Technology Letters
Volume
33
Issue
2
Copyright Statement
© The Author(s) 2023. This work is licensed under a Creative Commons Attribution 4.0 License. For more information, see https://creativecommons.org/licenses/by/4.0/
The erratum to the article is at https://ieeexplore.ieee.org/document/10042146. The Spiral record is https://spiral.imperial.ac.uk/handle/10044/1/102761
The erratum to the article is at https://ieeexplore.ieee.org/document/10042146. The Spiral record is https://spiral.imperial.ac.uk/handle/10044/1/102761
License URL
Identifier
https://ieeexplore.ieee.org/abstract/document/10004871
Publication Status
Published
Article Number
LMWT3220364
Date Publish Online
2023-01-03