Towards an Inductively Coupled Power/Data Link for Bondpad-Less Silicon Chips
File(s)ISCAS2011_Song_Submitted.pdf (1.11 MB)
Accepted version
Author(s)
Luan, S
Eftekhar, A
Murphy, O
Constandinou, TG
Type
Conference Paper
Abstract
This paper explores the concept of developing a bondpad-less fullyintegrated inductive link for power/data transfer between a silicon chip and a PCB. A key feature of the implemented system is that it requires no off-chip components. The proposed chip uses a standard 0.35um process and occupies an area of 2.5 x 2.5 mm^2. 9mW power was designed to be obtained on-chip through 900MHz carrier wave. Binary Phase Shift Keying (BPSK) and Load shift keying (LSK) are used for the the PCB-to-chip and chip-to-PCB link respectively for half-duplex communication.
Version
Accepted version
Date Issued
2011
Citation
Proc. IEEE ISCAS, 2011, pp.7-10
Publisher
IEEE
Source Title
IEEE International Symposium on Circuits and Systems (ISCAS)
Start Page
7
End Page
10
Journal / Book Title
Proc. IEEE ISCAS
Copyright Statement
© 2011 IEEE.Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
Source
IEEE International Symposium on Circuits and Systems (ISCAS)
Source Place
Rio De Janeiro, Brazil
Publication Status
Published
Start Date
2011-05-15
Finish Date
2011-05-18
Coverage Spatial
Rio De Janeiro, Brazil