Quality assessment and damage detection in nanomodified adhesively-bonded composite joints using inkjet-printed interdigital sensors
File(s)
Accepted version
Author(s)
Bekas, DG
Sharif-Khodaei, Z
Baltzis, D
Aliabadi, MHF
Paipetis, AS
Type
Journal Article
Abstract
In this work, the development of a planar interdigital capacitive sensor, directly onto the surface of a composite, for determining the initial quality of curing of bonded composite joints and assessing their long-term durability is presented. The sensor consisted of an interlocking comb-shaped array of silver electrodes and used to monitor the progress of cure of an adhesive resin and the subsequent damage state of the bond line in adhesively-bonded composite joints using impedance spectroscopy. The obtained results from the mechanical characterization indicated that the developed sensor did not affect the quality of the bondline while the added weight of the sensor is negligible. The curing process of the adhesive epoxy was successfully monitored while the ability of the sensor to assess the developed damage created by the mechanical loading was confirmed using transient infrared thermography.
Date Issued
2019-03-01
Date Acceptance
2019-01-02
Citation
Composite Structures, 2019, 211, pp.557-563
ISSN
0263-8223
Publisher
Elsevier
Start Page
557
End Page
563
Journal / Book Title
Composite Structures
Volume
211
Copyright Statement
© 2019 Elsevier Ltd. All rights reserved. This manuscript is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International Licence http://creativecommons.org/licenses/by-nc-nd/4.0/
Sponsor
Clean Sky Joint Undertaking
Grant Number
671435
Subjects
09 Engineering
Materials
Publication Status
Published
Date Publish Online
2019-01-03