The influence of primary Cu6Sn5 size on the shear impact properties of Sn-Cu/Cu BGA Joints
File(s)
Author(s)
Li, Z
Belyakov, S
Xian, J
Gourlay, C
Type
Journal Article
Abstract
A method is presented to control the size of primary Cu6Sn5 in ball grid array (BGA) joints while keeping all other microstructural features near-constant, enabling a direct study of the size of primary Cu6Sn5 on impact properties. For Sn-2Cu/Cu BGA joints, it is shown that larger primary Cu6Sn5 particles have a clear negative effect on the shear impact properties. Macroscopic fracture occurred by a combination of the brittle fracture of embedded primary Cu6Sn5 rods and ductile fracture of the matrix βSn. Cleavage of the Cu6Sn5 rods occurred mostly along (0001) or perpendicular to (0001) with some crack deflection between the two. The deterioration of shear impact properties with increasing Cu6Sn5 size is attributed to (1) the larger microcracks introduced by the brittle fracture of larger embedded Cu6Sn5 crystals, and (2) the less numerous and more widely spaced rods when the Cu6Sn5 crystals are larger, which makes them poor strengtheners.
Date Issued
2017-09-06
Date Acceptance
2017-08-22
Citation
Journal of Electronic Materials, 2017, 47 (1), pp.84-95
ISSN
0361-5235
Publisher
Springer
Start Page
84
End Page
95
Journal / Book Title
Journal of Electronic Materials
Volume
47
Issue
1
Copyright Statement
The final publication is available at Springer via http://dx.doi.org/10.1007/s11664-017-5763-7
Sponsor
Nihon Superior Co Ltd
Engineering & Physical Science Research Council (EPSRC)
Grant Number
N/A
EP/M002241/1
Subjects
Science & Technology
Technology
Physical Sciences
Engineering, Electrical & Electronic
Materials Science, Multidisciplinary
Physics, Applied
Engineering
Materials Science
Physics
Reliability
Cu6Sn5
Pb-free solder
electron backscatter diffraction
LEAD-FREE SOLDER
AG3SN PLATE FORMATION
AG-CU ALLOYS
MECHANICAL-PROPERTIES
FRACTURE-BEHAVIOR
ELECTRONIC INTERCONNECTIONS
INTERFACIAL MICROSTRUCTURE
INTERMETALLIC COMPOUNDS
GROWTH
STRENGTH
0906 Electrical And Electronic Engineering
Applied Physics
Publication Status
Published