Understanding the interaction of micro-voids and grain boundaries is critical to achieving superior mechanical properties for safety-critical parts. Micro-voids and grain boundaries may interact during advanced manufacturing processes such as sintering, additive manufacturing and diffusion bonding. Here, we show imparted benefits on mechanical properties by achieving grain boundary migration across voids. The micro-mechanisms and quantitative analysis of grain boundary migration on local deformation were studied by integrated in-situ EBSD/FSE and crystal plasticity finite element modelling. It is revealed that a migrated grain boundary does not alter the activated slip systems but precludes grain boundary-multislip interaction around interfacial voids to alleviate stress concentrations. The stress mitigation caused by grain boundary migration is almost the same as that caused by void closure under the example diffusion bonding thermal-mechanical process used in this study. This new understanding sheds light on the mechanistic link between GND hardening, grain boundary migration and the corresponding material tensile behaviour. It opens a new avenue for achieving superior mechanical properties for metallic parts with micro-defects such as those generated in diffusion-bonded, sintered and additive manufactured components.