Coprime polynomial based dual-circulant modulation for inherent submodule voltage balancing in MMDC
File(s)
Author(s)
Type
Journal Article
Abstract
The modular multilevel dc-dc converters (MMDCs) have attracted much interest in medium voltage dc applications, but have to face the main issue of balancing submodule (SM) capacitor voltages. This paper proposes a dual-circulant modulation and proves it possessing the inherent balancing capability for arbitrary operation cases. High-speed communication for real-time sensor data transfer could be avoided, which reduces implementation costs and also enhances the system reliability. Two sets of circular switching patterns are preset and combined to complete the full constrains on SM voltages. The associated polynomial of circulant matrix is introduced and the coprime of polynomials demonstrates the full-rank feature of the extended switching matrix that promises the inherent balancing for any operation cases. Then the switching patterns are reallocated and optimized to keep the SM uniformity and reduce the capacitor voltage ripple at the same time. Full-scale simulations on MMDC models and down-scaled experiments on prototypes are both presented, which validates the inherent voltage balancing capability and the optimization of SM capacitor voltage ripple with the proposed dual-circulant modulation.
Date Issued
2023-10-01
Date Acceptance
2022-11-13
Citation
IEEE Transactions on Industrial Electronics, 2023, 70 (10), pp.10134-10145
ISSN
0278-0046
Publisher
Institute of Electrical and Electronics Engineers
Start Page
10134
End Page
10145
Journal / Book Title
IEEE Transactions on Industrial Electronics
Volume
70
Issue
10
Copyright Statement
© 2022 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
Publication Status
Published
Date Publish Online
2022-12-01