Heterogeneous nucleation of βSn on NiSn4, PdSn4 and PtSn4
File(s)
Accepted version
Author(s)
Belyakov, SA
Gourlay, CM
Type
Journal Article
Abstract
During Pb-free soldering, βSn often requires a high nucleation undercooling and there is an ongoing effort to develop nucleation catalysts. It is shown here that NiSn4, PdSn4 and PtSn4 are heterogeneous nucleants for βSn, reducing the nucleation undercooling to ∼4 K when these intermetallics are present either in the bulk solder or as the interfacial layer. Nucleation catalysis occurs by βSn nucleating on the (0 0 8) facet of XSn4 crystals with an orientation relationship (OR) (1 0 0)Sn||(0 0 8)XSn4 and [0 0 1]Sn||[1 0 0]XSn4 where there is a planar lattice match of ∼5%. This OR is also the origin of well-aligned lamellar βSn–XSn4 eutectic morphologies, even though the eutectics contain less than 2 vol.% of faceted NiSn4, PdSn4 or PtSn4.
Date Issued
2014-03-28
Date Acceptance
2014-02-28
Citation
Acta Materialia, 2014, 71, pp.56-68
ISSN
1873-2453
Publisher
Elsevier
Start Page
56
End Page
68
Journal / Book Title
Acta Materialia
Volume
71
Copyright Statement
© 2014 Elsevier. Licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International http://creativecommons.org/licenses/by-nc-nd/4.0/
Sponsor
Nihon Superior Co Ltd
Engineering & Physical Science Research Council (EPSRC)
Grant Number
N/A
EP/M002241/1
Subjects
Science & Technology
Technology
Materials Science, Multidisciplinary
Metallurgy & Metallurgical Engineering
Materials Science
MATERIALS SCIENCE, MULTIDISCIPLINARY
METALLURGY & METALLURGICAL ENGINEERING
Intermetallic compounds
Heterogeneous nucleation of phase
Eutectic
Soldering
Supercooling
AG-CU SOLDER
PB-FREE SOLDERS
TENSILE PROPERTIES
ALLOYS
JOINTS
SOLIDIFICATION
AUSN4
NI
MICROSTRUCTURE
BEHAVIOR
Materials
0912 Materials Engineering
0913 Mechanical Engineering
Publication Status
Published