Molecular dynamics investigation on the interfacial shear creep between carbon fiber and epoxy matrix
File(s)9-APPLIED SURFACE SCIENCE.pdf (1.1 MB)
Accepted version
Author(s)
Tam, Lik-ho
Jiang, Jinqiao
Yu, Zechuan
Orr, John
Wu, Chao
Type
Journal Article
Abstract
Carbon fiber-reinforced polymer (CFRP) composite is subject to external loads during service life, suffering the interfacial creep between the fiber and the matrix and eventually the interfacial slippage. CFRP composite loses the interfacial integrity due to the interfacial creep and the long-term durability is weakened. In order to understand the degradation, microscopic details of interfacial structural changes during the creep are essential. This study aims to investigate microscopic creep behavior of a carbon fiber/epoxy interface at different shear load levels using molecular dynamics simulations. A molecular interface model consisting of an epoxy molecule bonded to graphite sheets representing the fiber outer layer is constructed, which is validated by comparing the mass density, glass-transition temperature and Young’s modulus of bonded epoxy with experimental measurements. According to the creep simulation, there is a threshold stress for the onset of creep failure, above which the interface detaches. Comparatively, no interfacial detachment occurs under the low stress regime, where the displacement–force curve is plotted and used to quantify the energy barrier to the onset of creep failure. Meanwhile, the strain and stress evolution of the interface are correlated to interfacial structural changes to understand the interfacial creep mechanism. This study provides molecular insights into the interfacial creep behavior in the fiber/matrix system and form the basis of multiscale investigation framework on the interfacial creep behavior.
Date Issued
2021-01-30
Date Acceptance
2020-09-27
Citation
Applied Surface Science, 2021, 537
ISSN
0169-4332
Publisher
Elsevier
Journal / Book Title
Applied Surface Science
Volume
537
Copyright Statement
Copyright © Elsevier Ltd. All rights reserved. This manuscript version is made available under the CC-BY-NC-ND 4.0 license https://creativecommons.org/licenses/by-nc-nd/4.0/
Copyright URL
Identifier
https://www.webofscience.com/api/gateway?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:000582798700125&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=a2bf6146997ec60c407a63945d4e92bb
Subjects
BEHAVIOR
Carbon fiber/epoxy interface
Chemistry
Chemistry, Physical
COMPOSITES
Creep behavior
CROSS-LINKING
ENVIRONMENT
FUNCTIONALIZATION
Interfacial integrity
Materials Science
Materials Science, Coatings & Films
MECHANICAL-PROPERTIES
Molecular dynamics simulation
Physical Sciences
Physics
Physics, Applied
Physics, Condensed Matter
REINFORCED POLYMER
Science & Technology
STRESS
Technology
TEMPERATURE
TRANSITION
Publication Status
Published
Article Number
148013
Date Publish Online
2020-09-30