A 4-wire interface SoC for shared multi-implant power transfer and full-duplex communication
File(s)Ghoreish2016.pdf (1.66 MB)
Accepted version
Author(s)
Ghoreishizadeh, S
Haci, D
Liu, Y
Constandinou, T
Type
Conference Paper
Abstract
This paper describes a novel system for recovering power and providing full-duplex communication over an AC-coupled 4-wire lead between active implantable devices. The target application requires a single Chest Device be connected to a Brain Implant consisting of multiple identical optrodes that record neural activity and provide closed loop optical stimulation. The interface is integrated within each optrode SoC allowing full-duplex and fully-differential communication based on Manchester encoding. The system features a head-to-chest uplink data rate (1.6 Mbps) that is higher than that of the chest-to-head downlink (100kbps) superimposed on a power carrier. On-chip power management provides an unregulated 5 V DC supply with up to 2.5 mA output current for stimulation, and a regulated 3.3 V with 60 dB PSRR for recording and logic circuits. The circuit has been implemented in a 0.35 μm CMOS technology, occupying 1.4 mm 2 silicon area, and requiring a 62.2 μA average current consumption.
Date Issued
2017-06-15
Date Acceptance
2016-12-08
Citation
2017 IEEE 8th Latin American Symposium on Circuits & Systems (LASCAS), 2017, pp.49-52
ISSN
2473-4667
Publisher
IEEE
Start Page
49
End Page
52
Journal / Book Title
2017 IEEE 8th Latin American Symposium on Circuits & Systems (LASCAS)
Copyright Statement
© 2017 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
Sponsor
Imperial College London
Wellcome Trust
Grant Number
BH134389
Source
IEEE Latin American symposium on Circuits and Systems (LASCAS)
Subjects
Science & Technology
Technology
Engineering, Electrical & Electronic
Engineering
TELEMETRY
CHIP
Publication Status
Published
Start Date
2017-02-20
Finish Date
2017-02-23
Coverage Spatial
Bariloche, Argentina